OSIE-2 PUCK telecon notes: 6/16/2009

Attendees: Waldmann, Cater, O'Reilly


1. Update from Bremen and Kiel - Waldmann, Zedlitz
Jesper Zedlitz sent an update on Kiel activities; O'Reilly distributed to group. Activities include:
a) Java instrument driver bytecode is stored in PUCK, retrieved and executed by system
b) Device hot-plugging; this can be difficult with just 3 wires and requirement to start in "instrument mode".
c) How to prevent malicious PUCK payloads from executing on observatory? We now look for digitally signed payloads - need to test in embedded system.
Christoph indicates that Jesper's team is not using the external prototype board, but rather simulating PUCK somehow - will ask Jesper for details.

Christoph has two students from UPC working on IEEE-1451 and using MBARI's external PUCK prototype. They are writing final report on their activities - Christoph will send report. Note that Jesper is using a "simulated PUCK" in Kiel.

2. Update from MMI and Axys - Cater
Axys is evaluating work to integrate PUCK into MI buoy - will response shortly.

3. Update from UPC - del Rio, Toma
UPC guys unable to attend today

4. MBARI external PUCK prototype modification - Headley, O'Reilly
Note that these issues do not effect embedded PUCK implementations. Several weeks ago UPC team discovered a few problems with external PUCK, including:
a) PUCK commands from host are passed to instrument by PUCK, even while in PUCK mode.
b) External PUCK has become unresponsive on a few occasions - reset required
c) When in PUCK mode, external PUCK responds to PUCK softbreak from host as an error - should be treated as OK. Need to update specification document state diagram to reflect proper behavior.

Headley is working with UPC guys to verify modified PUCK circuitry.

5. PRDK software update - O'Reilly
Several bugs have been fixed and improvements made - now in test. Hope to release soon.

6. Other items?
Christoph would like to loan PUCK hardware to Klaus Schleisek. O'Reilly says OK. Klaus is managing director of SEND GmbH, which manufacturers seafloor seismometers and other instruments. Klaus will attend next week's telecon.

Neil will be away for the next few weeks